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A thermal-mechanical coupled finite element analysis model of solder joints is established, which plays a role in mechanical support and electrical connection in flip chip. Periodic temperature cycle load (−45°C∼125°C) applied on the solder joints and it will generate periodic internal stress and strain in the process of the(More)
1 National Key Laboratory of Electro-Mechanics Engineering and Control, School of Mechanical-electronic 6 Engineering, Beijing Institute of technology, Beijing 100081, China; wangdakui1987@163.com (D.-K.W.); 7 louwz@bit.edu.cn (W.-Z.L.); fengyue@bit.edu.cn (Y. F.) 8 2 Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences,(More)
MEMS (Micro-electromechanical Systems) becomes important increasingly due to the smarter and smaller fuze used in OICW (Objective Individual Combat Weapon). MEMS Safety and Arming (S&A) device is employed in different platforms and regions for small caliber projectile. Therefore, it is necessary to make a parametric study of the MEMS S&A device in different(More)
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