Frank Ebling

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A new-generation interconnect for optical backplane systems based on printed circuits board is presented for transmitting data via integrated multimode polymer optical waveguides both on electro-optical transmitter/receiver processing boards and on optical backplane board. Different developments concerning this system such as optical waveguide technology,(More)
The paper deals with the development of silicon tools and an appropriate hot embossing technology for polymers. With this technology, high quality embossing of optical or fluidic structures for high precision requirements in a batch process is possible thereby reducing system costs. Possible usage is the production of Micro Electro Mechanical Systems (MEMS)(More)
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