Francesco Beneventi

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Compact thermal models and modeling strategies are today a cornerstone for advanced power management to counteract the emerging thermal crisis for many-core systems-on-chip. System identification techniques allow to extract models directly from the target device thermal response. Unfortunately, standard Least Squares techniques cannot effectively cope with(More)
Aggressive thermal management is a critical feature for high-end computing platforms, as worst-case thermal budgeting is becoming unaffordable. Reactive thermal management, which sets temperature thresholds to trigger thermal capping actions, is too "near-sighted", and it may lead to severe performance degradation and thermal overshoots. More aggressive(More)
—High temperature is one of the limiting factors and major concerns in 3D-chip integration. In this paper we use a 3D test chip (WIDEIO DRAM on top of a logic die) equipped with temperature sensors and heaters to explore thermal effects. We correlated real temperature measurements with the power dissipated by the heaters using model learning techniques. The(More)
Dynamic thermal management (DTM) is a key technology for future many-core systems. Indeed systems, as both server-class and embedded chip multiprocessors are thermally constrained. DTM design requires consideration for the chain of interactions between HW operating points, workload phases, power consumption, die temperature, HW monitor infrastructure,(More)
Self-heating and high-operating temperature are major concerns in 3-D-chip integration. In this paper, we leverage a 3-D test chip (WideIO dynamic random access memory on top of a logic die) equipped with temperature sensors and heaters to explore thermal effects and to develop advanced thermal modeling strategies suitable for complex 3-D-stacked circuits.(More)