Francesco Beneventi

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Compact thermal models and modeling strategies are today a cornerstone for advanced power management to counteract the emerging thermal crisis for many-core systems-on-chip. System identification techniques allow to extract models directly from the target device thermal response. Unfortunately, standard Least Squares techniques cannot effectively cope with(More)
—High temperature is one of the limiting factors and major concerns in 3D-chip integration. In this paper we use a 3D test chip (WIDEIO DRAM on top of a logic die) equipped with temperature sensors and heaters to explore thermal effects. We correlated real temperature measurements with the power dissipated by the heaters using model learning techniques. The(More)
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