Franc Dugal

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High power modules are still facing the challenges to increase their power output, increase the junction temperature, and increase their reliability in harsh conditions. Therefore in the full paper from this study a detail analysis of this solder joint was reported [1]. The intermetallic phases and the microstructure of standard chip to substrate solder(More)
We present a newly developed 4500 V and 2000 A Press-Pack IGBT module for power transmission and industrial voltage drives applications. The module employs SPT IGBT chips with exceptionally low losses and high Safe Operating Area (SOA). The use of SPT IGBT chips in this Press Pack IGBT module allows for higher power densities and the package provides a(More)
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