F. Minami

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
The idea of the Weibull stress, which is based on the “local approach”, has been applied to delamination failure analyses of semiconductor packages. Interface fracture strengths between package mold resin and 42 alloy lead frame are obtained by a conventional shear test with three resin sizes and two shear heights. Six different facture(More)
  • 1