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Journals and Conferences
The present work proposes an approach to generate Dynamic Compact Thermal Models or “DCTMs” dedicated to electronic components. This one is based on the European project DELPHI, which defined the… (More)
Nowadays a high-level integration with unprecedented functionality and efficient performances is achieved through 3D packaging techniques known as System-In-Package (SIP). The paper describes the… (More)
Due to the packages getting smaller, their power dissipation is henceforth mainly drained through the PCB. Besides the dissipation challenges that are seen today with single-chip components will only… (More)
Emerging packages offer diverse options for mounting active and passive devices in a single package, such as side by side, embedded or stacked die placements.
Nowadays, thermal designers have to deal with sophisticated 3D component packaging, enclosing several chips or conventional individually-packaged Integrated circuits with various power densities,… (More)
The thermal dissipation challenges that are seen today with single-chip components will only be magnified with the introduction of System in Package devices.
Board-level simulation considers the challenging process of analysing the impact of the vicinity of high and medium powered devices on the sensitive ones. This level of design is often considered in… (More)
This work proposes an approach to generate Dynamic Compact Thermal Models dedicated to electronic components. This one is based on the result of the European project DELPHI, which can be considered… (More)
The trend at the level of electronic component is to gather several active chips inside the same enclosing package. The thriving development of this technology allows reducing the volume in space as… (More)
The latest low-profile high-power inductors, used in DC-DC converter to power an assortment of applications, are going endlessly smaller and submitted to larger amount of current. This… (More)