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In new product development, time to market (TTM) is critical for the success and profitability of next generation products. When these products include sophisticated electronics encased in 3D packaging with complex geometries and intricate detail, TTM can be compromised—resulting in lost opportunity. The use of advanced 3D printing technology enhanced with(More)
An innovative method for rapid prototyping (RP) of electronic circuits with components characteristic of typical electronics applications was demonstrated using an enhanced version of a previously developed hybrid stereolithography (SL) and direct write (DW) system, where an existing SL machine was integrated with a three-axis DW fluid dispensing system for(More)
Conductive inks are key enablers for the use of printing techniques in the fabrication of electronic systems. Focus on the understanding of aspects controlling the electrical performance of conductive ink is paramount. A comparison was made between microparticle Ag inks and an Ag nanoparticle ink. The microstructures resulting from thermal cure processes(More)
We address numerical dispersion compensation based on the use of the fractional Fourier transform (FrFT). The FrFT provides a new fundamental perspective on the nature and role of group-velocity dispersion in Fourier domain OCT. The dispersion induced by a 26 mm long water cell was compensated for a spectral bandwidth of 110 nm, allowing the theoretical(More)
The SIERRA nightside auroral sounding rocket made observations of the origins of ion upflow, at topside F-region altitudes (below 700 km), comparatively large top-side plasma densities (above 20 000/cc), and low energies (10 eV). Upflowing ions with bulk velocities up to 2 km/s are seen in conjunction with the poleward edge of a nightside substorm arc. The(More)
A novel Single Event Upset (SEU) tolerant flip-flop design is proposed, which is well suited for very-low power electronics that operate in subthreshold (<Vt ≈ 500 mV). The proposed flip-flop along with a traditional (unprotected) flip-flop, a Sense-Amplifier-based Rad-hard Flip-Flop (RSAFF) and a Dual Interlocked storage Cell (DICE) flip-flop were all(More)
A very small drop of fluorescein solution was placed at the bottom of the lower fornix in human volunteers and its appearance in the tear film was measured. This was quite variable, but its appearance time averaged about 4 min and the peak of fluorescence 8 min. The time was shortened by blinking. The appearance time was too fast to be accounted for by(More)
— Three dimensional (3D) printing has recently gained attention in a variety of industries ranging from aerospace to biomedical. However, in order to create truly functional 3D printed structures, electronic functionality must be integrated into building sequence. This work explores the integration of both printed sensors (copper capacitive touch sensors)(More)