Highly Influential Citations1
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In this paper, we discuss the metrology methods and error budget that describe the edge placement error (EPE). EPE quantifies the pattern fidelity of a device structure made in a multi-patterning… Continue Reading
Pattern defects and uninvited particles (residuals) probably appear on Mask and Wafer in any manufacturing process of integrated circuits (ICs) and impact the final yield of IC chips. To ensure a… Continue Reading
We first came together because of Undercover, and we got to know each other through this common interest. Undercover brought us together here, and even though it has made us sad, it has also… Continue Reading
SUMMARY As we approach the third decade of AIDS, HIV prevention in the United States confronts expanding public concern about continuing infections among gay men. This paper provides a brief history… Continue Reading