Eoin O'Toole

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The early Caenorhabditis elegans embryo is currently a popular model system to study centrosome assembly, kinetochore organization, spindle formation, and cellular polarization. Here, we present and review methods for routine electron microscopy and 3D analysis of the early C. elegans embryo. The first method uses laser-induced chemical fixation to preserve(More)
NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer Level Ball Grid Array (eWLB) [1]. Since it's invention almost 10 years ago, it became the leading technology for Fan-Out Wafer-Level packages. The WLFO technology is based upon the reconstitution to wafer format of semiconductor dies or other active /(More)
eWLB (embedded Wafer Level Ball Grid Array) is a fan-out wafer level packaging (FO-WLP) technology, its core process is the encapsulation of active and/or passive components in epoxy mold compound (MC) acting as both the physical support of the components and the base of the fan-out area accommodating the second level connections. One eWLB solution is FIMP(More)
Market is requesting more and more IC packages capable to cope with more demanding reliability requirements, in order to meet customer increased expectations regarding functionality, size, power dissipation and cost. Miniaturization needs, in an increasing number of applications, accelerate the implementation of WLP (Wafer Level Packaging) even in market(More)
With technology related shrink and ever increasing functionality being included in individual semiconductor dies, dies are becoming smaller with an ever increasing number of I/Os. These two facts are accelerating migration to FanOut wafer level packaging whilst the increased number of I/Os with reduced die pad pitch is forcing the use of multiple(More)
Embedded Wafer Level Ball Grid Array (eWLB) [1] since it's invention has been the leading technology for Fan-Out Wafer-Level package. The development of eWLB technology involving the patterning of a Redistribution Layer over a reconstituted wafer has been hampered by remaining metal from the test structures applied by the foundries in the dicing streets of(More)
With increasing focus on system approaches, also advanced semiconductor packaging becomes more diversified and fairly more complex. Development of the so called "More-than-Moore" (MtM) solutions, the heterogeneous integration of more functionality, distributed on a number of single elements inside the package, on less footprint and height, is(More)
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