Enno Lorenz

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In this study the bending reliability of an isotropic conductive adhesive (ICA) filled between two printed circuit foils (PCF) as interconnection for a System-in-Foil is evaluated. The filling is realized by a Jet-Dispense process on oxygen plasma treated, as well as non-plasma treated foils. The samples are tested on a bending test setup capable of(More)
With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent(More)
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