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This paper presents new insights into board level drop impact using analytical relations that have been developed. The dominance of bending moment as a failure driver leads naturally to the dynamic–static analysis technique, which together with the dominance of fundamental flexing mode led to a simple relation for interconnection stress. Using this(More)
This paper presents a thermo-mechanical analysis of a multichip module (MCM) package design, with emphasis on the package warpage, thermally induced stress and the second level solder joint reliability. The MCM package contains four flip chips which are mounted on a build up substrate. First, the effect of the positioning of four silicon dice within the MCM(More)
RAM was a specialized electronic chip which multiple integrated circuits (ICs), semiconductor or other discrete components were packaged onto a unifying substrate. Facilitating their use as a single component (as though a larger IC). This paper presented model calculated the temperature distribution on four parallel memory modules and studied the effect of(More)
Article history: Received 11 July 2016 Received in revised form 16 August 2016 Accepted 16 August 2016 Available online xxxx Techniques for enforcing the continuity of solute field in heterogeneous solvent under the conditions of steady temperature-humidity, steady temperature but dynamic humidity, and dynamic temperature are reviewed. The continuity of the(More)