Eakhwan Song

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We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic <i>RLGC</i> equations derived from the(More)
In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from a TSV. It is important to estimate the TSV noise transfer function and manage the noise-tolerance budget in the design of a reliable 3D-IC system. In this paper, a TSV noise coupling model(More)
In this paper, we propose a coupling model between through silicon via (TSV) and substrate based on a 3-Dimensional transmission line matrix (3D-TLM), which utilizes equivalent lumped circuit model of silicon substrate and TSV. The proposed model is verified by S-parameter simulations using a 3D field solver and analyzed with various structural parameters:(More)
We propose a closed-form analytic model for the newly presented passive equalizer using near-end crosstalk and reflections on printed circuit board (PCB). The proposed model is developed by using impulse response analysis and the Fourier transform. Based on the model, we propose a design-optimization procedure for the passive equalizer, which achieves(More)
In this letter, a radio-frequency interference (RFI) evaluation method for highly integrated mobile devices, such as smartphones and tablets, is proposed. A near-field specification for noise-emitting components in mobile devices is developed based on near-field emission measurements and RF sensitivity measurements of mobile devices with the bit-error-rate(More)
Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC) system. However, high-speed digital signals suffer from severe distortions induced by TSV interconnects. In this paper, we propose a TSV equalizer using an ohmic contact on a double-sided silicon interposer to reduce the(More)
In modern electronic products, the noise from high-speed digital parts is likely to interfere with nearby receivers, causing radio-frequency interference (RFI) issues. In this paper, the equivalent dipole-moment models and a decomposition method based on reciprocity theory are proposed being used together to estimate the coupling from the noise source to(More)
In this work, we developed a sophisticated low-cost and wide-band passive equalization method for high-speed differential interconnects. The proposed method was based on a high-pass filter design using parasitics that exist in multi-layer printed circuit board (PCB) interconnects. By employing the parasitics as the filter design components, the proposed(More)
The mixed-mode ABCD parameters are newly introduced and developed, where the definition and the connection are carefully established to have both the advantages of the mixed-mode S-parameters and the ABCD parameters, simultaneously. In addition, closed-form equations to model symmetric and asymmetric coupled transmission lines are derived. With the derived(More)
In this paper, we proposed an effective coil design for electromagnetic field (EMF) noise reduction from the wireless power transfer system by using quadruple coils in transmitter and receiver for laptop computer application. By using quadruple coils for transmitter and receiver, EMF noise was significantly reduced with negligible change in induced voltage.(More)