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  • E. Suhir
  • 2016
When encountering a particular reliability problem at the design, fabrication, testing, or an operation stage of an electronics product's life, and considering the use of predictive modeling to assess the seriousness and possible consequences of its detected malfunction and likely failure, one has to choose whether a statistical, or a(More)
Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive IC devices is currently viewed as an attractive advanced packaging option having a strong potential in the automotive industry and beyond. A natural reliability concern, however, is the level of the thermally induced stresses in a multi-material assembly(More)
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