Dustin W. Carr

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—This paper discusses a two-piece approach for fabricating two-dimensional (2-D) arrays of tilting MEMS mirrors with application in very-large optical cross-connect switches. In the new process, a two-sided etching of silicon-on-insulator (SOI) wafers is used to create crystalline mirrors on a first wafer that is later aligned and bonded to a separate wafer(More)
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