Doug C. H. Yu

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It has become essential in policy and decision-making circles to think about the economic benefits (in addition to moral and scientific motivations) humans derive from well-functioning ecosystems. The concept of ecosystem services has been developed to address this link between ecosystems and human welfare. Since policy decisions are often evaluated through(More)
  • Doug C. H. Yu
  • Proceedings of the IEEE 2014 Custom Integrated…
  • 2014
New System-in-Package (SiP) with innovative Wafer-Level-System-Integration (WLSI) technologies that leverage foundry core competence on wafer processes have been demonstrated. The WLSI technologies include Chip-on-Wafer-on-Substrate (CoWoS<sup>TM</sup>) 3DIC and interposer, Integrated Fan-Out (InFO) and Chip-Scale Wafer-Level-Packaging. Wide application(More)
Wafer level system integration (WLSI) as the new system scaling technology platform is taking the stage in parallel to transistor level Moor's Law scaling to drive the semiconductor industry moving forward in new mobile computing and Internet-of-Thing (IoT) markets. Two key WLSI technology platforms, Chip-on-Wafer-on-Substrate (CoWoS) and Integrated Fan-Out(More)
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