Doug C. H. Yu

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New System-in-Package (SiP) with innovative Wafer-Level-System-Integration (WLSI) technologies that leverage foundry core competence on wafer processes have been demonstrated. The WLSI technologies include Chip-on-Wafer-on-Substrate (CoWoS<sup>TM</sup>) 3DIC and interposer, Integrated Fan-Out (InFO) and Chip-Scale Wafer-Level-Packaging. Wide application(More)
Wafer level system integration (WLSI) as the new system scaling technology platform is taking the stage in parallel to transistor level Moor's Law scaling to drive the semiconductor industry moving forward in new mobile computing and Internet-of-Thing (IoT) markets. Two key WLSI technology platforms, Chip-on-Wafer-on-Substrate (CoWoS) and Integrated Fan-Out(More)
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