Dongming Guo

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Based on the integrated circuit equipments, this paper respectively introduces the constitute and function of the automated wafer-handling system, the design and principle of the wafer-handling robot, wafer positioning system, and end-effector calibration system. This paper studies the up-down and rotation component, radial linear stretch component, end(More)
In this paper we present a new framework to approach the problem of structural shape and topology optimization. We use a level set method with an implicit moving boundary model. As a boundary optimization problem, the structural boundary description is implicitly embedded in a scalar function as its " iso-surfaces. " Such level set models are flexible in(More)
Deformation twinning evolution from a single crystal is conducted by molecular dynamics simulations, to elucidate a twinned face-centered-cubic alloy in an experiment with hardness up to 100 times as that of single crystals, and with ductility simultaneously. Critical twinning stress of cadmium zinc telluride (CdZnTe or CZT) calculated is 1.38 GPa. All the(More)
A giant magnetostrictive microdisplacement actuator (GMA), which has the function of sensing its microdisplacement, was developed. A circular membrane-type flexible mechanism was proposed to be the GMA's microdisplacement transfer mechanism, which characterized compact structure, zero friction, no driving gap and self-restoring force. The principle of(More)
Nanoscale solely amorphous layer is achieved in silicon (Si) wafers, using a developed diamond wheel with ceria, which is confirmed by high resolution transmission electron microscopy (HRTEM). This is different from previous reports of ultraprecision grinding, nanoindentation and nanoscratch, in which an amorphous layer at the top, followed by a crystalline(More)
A novel approach of chemical mechanical polishing (CMP) is developed for mercury cadmium telluride (HgCdTe or MCT) semiconductors. Firstly, fixed-abrasive lapping is used to machine the MCT wafers, and the lapping solution is deionized water. Secondly, the MCT wafers are polished using the developed CMP slurry. The CMP slurry consists of mainly SiO2(More)
A novel approach of chemical mechanical polishing (CMP) is developed for cadmium zinc telluride (CdZnTe or CZT) wafers. The approach uses environment-friendly slurry that consists of mainly silica, hydrogen peroxide, and citric acid. This is different from the previously reported slurries that are usually composed of strong acid, alkali, and bromine(More)