Dongkeun Oh

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Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-level 3D thermal analysis is crucial for thermal integrity analysis. In this paper, we formulated an analytical Green function solution of the 3D temperature distribution in a(More)
Technology scaling has allowed integration of multiple cores into a single die. However, high power consumption of each core leads to very high heat density, limiting the throughput of thermal-constrained multi-core processors. To maximize the throughput, various software-based dynamic thermal management and optimization techniques have been proposed, many(More)
—A novel virtual power source (VPS) method is proposed that can significantly speedup 3-D integrated circuit (IC) thermal simulation with sparely deployed thermal TSVs leveraging Green function-based analytical spectral method. Specifically, it is shown that the impact of TSVs with nonhomogeneous thermal conductivity on thermal simulation may be modeled as(More)
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