Dong Shurong Yan

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RAM was a specialized electronic chip which multiple integrated circuits (ICs), semiconductor or other discrete components were packaged onto a unifying substrate. Facilitating their use as a single component (as though a larger IC). This paper presented model calculated the temperature distribution on four parallel memory modules and studied the effect of(More)
The compounds BeO, AlN, and Sic (AB type) belong to the family of “GrimmSommerfeld compounds.” These compounds crystallize in the same hexagonal wurtzite (84) structure. Such a structure can be considered as being composed of two interpenetrating hexagonal closepacked sublattices, one of atoms A, the other of atoms B (I, 2). A and B form interpenetrating(More)
A novel dual direction SCR (DDSCR) ESD protection device is implemented in HJTK 0.18-¿m CMOS process without deep N-well or T-well masks. Both parallel and anti-parallel metal routing method of multi-fingered DDSCR is investigated in this paper. It shows that metal routing in layout design plays an important role in the performance of multi-fingered DDSCR(More)
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