Dimitri R. Kioussis

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We address package-induced degradation of BEOL interconnects and approaches for recovery. For dielectrics, we cover process options and position in stack for ULK films and how these lead to differences in strength. Experiments were designed to cross-compare multiple methods to test susceptibility of BEOL interconnect to CPI damage. We also address how Chip(More)
We have developed poly(allyl amine hydrochloride) (PAA · HCl) polymer hydrogels, that efficiently remove nitrate (NO3 ), nitrite (NO2 ), and orthophosphate (PO4 ) nutrient anions from the aquaculture wastewater. The hydrogels were prepared by chemically crosslinking linear PAA · HCl chains with epichlorohydrin (EPI). The anion binding capacity of the pH(More)
Ion exchange systems for the removal of nutrient pollutants, even at extremely low concentrations, from wastewater effluents are a major environmental need. This work reports on the features of batch sorption processes for the ultimate removal and recovery of reactive phosphorus, nitrogen, and sulfur anions from aquaculture production wastewater effluents.(More)
Methods that will remove conventional nutrient pollutants such as reactive phosphorus, even at extremely low concentrations, from wastewater effluents are a major need in the aquaculture industry. In this study, novel phosphate binding crosslinked poly(allylamine), PAA · HCl, polymeric hydrogel materials were developed, which efficiently bind phosphate(More)
During technology development, the study of low-k TDDB is important for assuring robust chip reliability. It has been proposed that the fundamentals of low-k TDDB are closely correlated with the leakage conduction mechanism of low-k dielectrics. In addition, low-k breakdown could also be catalyzed by Cu migration occurring mostly at the interface between(More)
Systems that are capable of removing highly toxic anions from wastewater effluents, even at extremely low concentrations, are a major need in the defense industry. This study reports on the features of two new batch and continuous-flow sorption processes with regard to ultimate removal and recovery of the perchlorate (ClO4 ) anion from ammonium perchlorate(More)
The paper examines the factors that affect the formation of delaminations under C4 joints during chip joining. Through multiscale finite element modeling and chip joining experiments we find that two important parameters determining the susceptibility to C4 delaminations (white bumps) are the effective modulus of the low-K levels in the BEOL stack and the(More)
This work reports on morphological features of hydrogels, which have been used for the ultimate removal and recovery of nutrient and toxic anions from wastewater effluents. The sorbent used was crosslinked polyamine (PAA$HCl) polymeric hydrogels. The surface topography and morphology of these hydrogels were characterized by tapping mode atomic force(More)
While the spacing of interconnect structures has continued to scale with technology generation, operating voltages have not scaled accordingly leading to inevitable higher electric fields across BEOL dielectrics. Moreover, the introduction of ULK materials with lower dielectric constant is necessary to scale capacitance, however, this comes at a significant(More)
A multilevel back-end-of-line structure with a dielectric constant k ≤ 2.4 ultra low-k materials was developed. k=3D2.2 ULK build was demonstrated at a 144nm wiring pitch and a k=3D2.4 ULK was demonstrated at a 288nm pitch. Good model-to-hardware correlation for the measured capacitance indicated no significant plasma damage to the ULK(More)