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Field-programmable gate arrays (FPGAs) have become increasingly interesting in system design and due to the rapid technological progress ever larger devices are commercially affordable. These trends make FPGAs an alternative in application areas where extensive data processing plays an important role. Consequently, the desire emerges for early performance(More)
This article presents the RF characterization results of a large-area MCM-D technology developed within the EU LAP project. Microstrip lines were simulated, designed, and manufactured in several material combinations. Measurements up to 120 GHz showed good coincidence between simulation and reality. Future work is dedicated to filters and antennas in the 77(More)
The future trend in wearable computing is to integrate electronics directly into textiles. Our approach is to use conductive textiles for signal transmission. We investigated the electrical performance of textile transmission lines. We present methods for measuring as well as for modeling the high frequency properties of textiles. With the results it is(More)
Recently, there was a significant growth in wireless telecommunication applications such as Cellurar and Mobile will shift more and more to the use of higher frequncies. Multichip Modules (MCMs) and MCM technologies are very close to micro-and milimeter-wave systems like transmitter/receivr (T/R) for radars and communication modules for wireless(More)
Two dedicated RF test vehicles (RF-TV) have been designed to characterise the high frequency performance of a new low-cost thin film (MCM-D) technology, fabricated on large area panels (LAP). Previous investigations revealed the capabilities of the new LAP technology to be used at frequencies up to 110 GHz. Test structures for transmission measurements,(More)
A new low cost thin film substrate technology was developed within the EU research project LAP. The project's substrate cost target of 1 US$/inch 2 shall be obtained by using low cost materials and large area panel processing (LAP). This paper presents tests and measurements showing the process accuracy and the geometric variations resulting from low cost(More)
Employing FPGAs for computing purposes requires a mapping process. Although this procedure saves substantial development time compared to the physical design of an ASIC, several mappings are almost always needed until the constraints can be met. The Performance Prediction Model (PPM [3]) is a means to help reducing the development time while providing an(More)
In this paper we investigate the influence of 1st-level packaging components on the electromagnetic behaviour of power electronic modules. The main goal is to identify the critical layout paths and packaging components and to understand the mechanisms that affect the module performance. Several power electronics packaging technologies are compared on the(More)