Didier Cottet

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Field-programmable gate arrays (FPGAs) have become increasingly interesting in system design and due to the rapid technological progress ever larger devices are commercially affordable. These trends make FPGAs an alternative in application areas where extensive data processing plays an important role. Consequently, the desire emerges for early performance(More)
This article presents the RF characterization results of a large-area MCM-D technology developed within the EU LAP project. Microstrip lines were simulated, designed, and manufactured in several material combinations. Measurements up to 120 GHz showed good coincidence between simulation and reality. Future work is dedicated to filters and antennas in the 77(More)
The future trend in wearable computing is to integrate electronics directly into textiles. Our approach is to use conductive textiles for signal transmission. We investigated the electrical performance of textile transmission lines. We present methods for measuring as well as for modeling the high frequency properties of textiles. With the results it is(More)
Employing FPGAs for computing purposes requires a mapping process. Although this procedure saves substantial development time compared to the physical design of an ASIC, several mappings are almost always needed until the constraints can be met. The Performance Prediction Model (PPM [3]) is a means to help reducing the development time while providing an(More)
A new low cost thin film substrate technology was developed within the EU research project LAP. The project’s substrate cost target of 1 US$/inch shall be obtained by using low cost materials and large area panel processing (LAP). This paper presents tests and measurements showing the process accuracy and the geometric variations resulting from low cost(More)
The goal of the paper is to present the procedure of the extraction and separation of dielectric material parameters and metalization-related process properties up to mm-wave frequencies based on the measurements of general microstrip lines set of different line cross-sections and lengths. The accuracy of the procedure has been tested up to 100GHz for the(More)
Three procedures allowing the systematic determination of the propagation characteristic of lines and deembedding the influence of feeding discontinuities are presented. All of them are based on the known measurement technique of two lines with different lengths on the measured substrate after earlier calibration with standard substrate. The first one(More)
In this paper we present a yield model detailing the impact of changing design rules to overall substrate cost. Using a simple yield model, we extracted the critical area for the “short/open failure” model mainly present for pure interconnect substrates. Introducing a density factor, the “short failure” critical area extraction could be simplified(More)
In our era of converging technologies, it is significant that the second Industrial Revolution should meet the first on common ground: textiles. Modern data processing is, after all, an offshoot of technology first introduced in the 18th century to automate the production of woven textiles. The punched-card system developed by J.-M. Jacquard in 1804 to(More)