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  • Diane Rébiscoul, Boris Puyrenier, Lucile Broussous, Didier Louis, Gérard Passemard
  • Materials Science
  • 2006 (First Publication: 1 November 2006)
  • Ultra low-K materials (ULK) are used as insulator between Cu interconnections. After via and line dry etching steps with a plasma, a cleaning step is generally mandatory. The cleaning solution andContinue Reading