Dennis W. Hess

P Markondeya Raj1
Victor Breedveld1
Fuhan Liu1
Rao Tummala1
Chandrasekharan Nair1
1P Markondeya Raj
1Victor Breedveld
1Fuhan Liu
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This paper presents the first demonstration of a " zero-undercut " precision formation of ultrafine-line copper conductor patterns for redistribution layers (RDL) and thin film RF passives. This is accomplished by using a highly-anisotropic and uniform copper plasma-etching process to remove the seed layer with no lateral etching of the copper patterns,(More)
Plasma-assisted oxidation, anodization, and nitridation of silicon have been performed in microwave, rf, and dc plasmas with a variety of reactor configurations and a range of plasma densities. Compared to thermal processes at equivalent substrate temperatures, film growth rates are accelerated by the plasma-enhanced generation of reactive chemical species(More)
Amphiphobic wood has successfully been fabricated using a combination of O2 plasma surface activation and coating of pre-hydrolyzed methyltrimethoxysilane (MTMS). The effect of O2 plasma activation on surface chemistry and surface roughness was investigated using X-ray photoelectron spectroscopy and laser scanning confocal microscope profilometry,(More)
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