David T. Naugle

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bumping P. A. Gruber L. Bélanger G. P. Brouillette D. H. Danovitch J.-L. Landreville D. T. Naugle V. A. Oberson D.-Y. Shih C. L. Tessler M. R. Turgeon As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several wafer-bumping processes have been developed to produce the small solder features(More)
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