David S. Ricketts

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Macroelectronic circuits made on substrates of glass or plastic could one day make computing devices ubiquitous owing to their light weight, flexibility and low cost. But these substrates deform at high temperatures so, until now, only semiconductors such as organics and amorphous silicon could be used, leading to poor performance. Here we present the use(More)
—We study and present design guidelines for thru-reflect line vector-network-analyzer calibration kits used for characterizing circuits and transistors fabricated on silicon integrated circuits at millimeter-wave frequencies. We compare contact-pad designs and develop fixed-fill contacts that achieve both repeat-able and low contact-pad capacitances. We(More)
The authors of this paper argue that systems with increased functionality may be achieved by using patterning technologies that enable direct writing on CMOS wafers. ABSTRACT | In this paper, we present a vision for the cointegration of deeply scaled complementary metal–oxide– semiconductor (CMOS) and emerging nanoelectronic devices into CMOS-hybrid(More)
—As externally powered microsystems become more common, designers need better tools to understand power delivery systems such as non-resonant capacitive coupling. In this paper we present the first general method which allows a designer to easily model power delivery through capacitive coupling. The method uses a power iteration technique which allows one(More)