David J. Walkey

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This paper presents a novel 3D thermal simulation tool for semiconductor integrated devices. The simulator is used to automatically generate an accurate 3D physical model of the device to be simulated from layout information. The simulator produces an appropriate mesh of the device based on a rectangular block structure. The mesh is automatically created(More)
A compact, efficient electrical dual-circuit topology for the representation of transient thermal coupling is presented. Based on controlled sources, the method allows an arbitrary level of complexity to be used for each self and coupled response. Two possible variations on the circuit form, and the resulting requirements for model extraction, are(More)
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