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The increasing processing capability of <i>Multi-Processor Systems-on-Chips (MPSoCs)</i> is leading to an increase in chip power dissipation, which in turn leads to significant increase in chip temperature. An important challenge facing the MPSoC designers is to achieve the highest performance system operation that satisfies the temperature and power(More)
The goal of thermal management is to meet maximum operating temperature constraints, while at the same time tracking time-varying performance requirements. Current approaches avoid thermal violations by forcing abrupt operating points changes (e.g. processor shutdown), which cause sharp performance degradation. In this paper we aim at achieving a smooth(More)
Energy harvesting sensor nodes (EHSNs) have stringent low-energy consumption requirements, but they need to concurrently execute several types of tasks (processing, sensing, actuation, etc.). Furthermore, no accurate models exist to predict the energy harvesting income in order to adapt at run-time the executing set of prioritized tasks. In this article, we(More)
Wireless body sensor networks (WBSN) hold the promise to be a key enabling information and communications technology for next-generation patient-centric telecardiology or mobile cardiology solutions. Through enabling continuous remote cardiac monitoring, they have the potential to achieve improved personalization and quality of care, increased ability of(More)
With increasing communication demands of processor and memory cores in <i>Systems on Chips (SoCs)</i>, scalable <i>Networks on Chips (NoCs)</i> are needed to interconnect the cores. For the use of NoCs to be feasible in today's industrial designs, a custom-tailored, application-specific NoC that satisfies the design objectives and constraints of the(More)
Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, vertical integration of high-performance ICs in the form of 3D stacks is highly demanding since the(More)
Solar panels are frequently used in wireless sensor nodes because they can theoretically provide quite a bit of harvested energy. However, they are not a reliable, consistent source of energy because of the Sun's cycles and the everchanging weather conditions. Thus, in this paper we present a fast, efficient and reliable solar prediction algorithm, namely,(More)
Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. The goal of thermal management is to meet maximum operating temperature constraints, while tracking timevarying performance requirements. Current approaches avoid thermal violations by forcing abrupt(More)
With the growing complexity in consumer embedded products, new tendencies forecast heterogeneous Multi-Processor Systems-On-Chip (MPSoCs) consisting of complex integrated components communicating with each other at very high-speed rates. Intercommunication requirements of MPSoCs made of hundreds of cores will not be feasible using a single shared bus or a(More)
— Three-dimensional (3D) circuits reduce communication delay in multicore SoCs, and enable efficient integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling efficiency becomes a limiting factor. Liquid cooling is a solution to overcome the accelerated(More)