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Microchannel heat sinks offer the promise of an effective and compact technique for heat dissipation from high-powered microelectronics. When combined with phase-change mechanisms, it is possible to… (More)
Advances in electronics such as chip level integration and die stacking have led to a bottleneck in further development since dissipation of the resulting high heat fluxes continues to be a… (More)
The BNL 704MHz SRF gun has a grooved choke joint to support the photo-cathode. Due to the distortion of grooves at the choke joint during the BCP for the choke joint, several multipacting barriers… (More)