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The objective of this work is to develop a data processing system that can automatically generate waypoints for navigation of an unmanned aerial vehicle (UAV) to inspect surfaces of structures like buildings and bridges. The input includes data recorded by two 2D laser scanners, orthogonally mounted on the UAV, and an inertial measurement unit (IMU). To(More)
Electromigration tests of SnAg solder bump samples with 15 µm bump height and Cu under-bump-metallization (UBM) were performed. The test conditions were 1.45ˆ10 4 A/cm 2 at 185 ˝ C and 1.20ˆ10 4 A/cm 2 at 0 ˝ C. A porous Cu 3 Sn intermetallic compound (IMC) structure was observed to form within the bumps after several hundred hours of current stressing. In(More)
The bulk elastic and piezoelectric properties of potassium titanyl phosphate (KTP) and some of its family members such as RbTiOPO(4 ) (RTP) and RbTiOAsO(4) (RTA) have been determined. The piezoelectric, elastic, and dielectric matrix (P-E-D) of KTP has been completely characterized. Values for the temperature dependence of the expansion coefficients and(More)
The Curie temperatures and dielectric properties of KTiOPO(4 ) (KTP), RbTiOPO(4), KTiOAsO(4), RbTiOAsO(4 ), CsTiOAsO(4), Ba:KTP, and Ga:KTP were measured with small-signal relative dielectric permittivity (kappa) analysis, piezoelectric resonance analysis, and optical second harmonic generation. All the isomorphs and the doped KTP exhibit lower Curie(More)
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