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2012, Volume 1, Issue 5, Pages N79-N84. ECS J. Solid State Sci. Technol. Wang, Jean-Sébastien M. Lehn, Huazhi Li and Deo Shenai Harish B. Bhandari, Jing Yang, Hoon Kim, Youbo Lin, Roy G. Gordon, Qing Min Advanced Copper Interconnects Application as an Adhesion-Enhancing Layer for Chemical Vapor Deposition of Cobalt Nitride and its service Email alerting(More)
Formation of Nickel Silicide from Direct-Liquid-Injection Chemical-Vapor-Deposited Nickel Nitride Films Zhefeng Li, Roy G. Gordon,* Huazhi Li, Deo V. Shenai, and Christian Lavoie Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts 02138, USA Dow Electronic Materials, North Andover, Massachusetts 01845, USA IBM, Thomas(More)
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