D. Pinjala

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This paper presents a thermo-mechanical analysis of a multichip module (MCM) package design, with emphasis on the package warpage, thermally induced stress and the second level solder joint reliability. The MCM package contains four flip chips which are mounted on a build up substrate. First, the effect of the positioning of four silicon dice within the MCM(More)
In this paper, the mathematical model of the modified step-theory is derived based on the platform of two-dimensional photonic crystal structure that is infinitely long in third dimension. The mode coupling mechanism of photonic crystal tapers is theoretically studied using the modified step-theory. The model is verified by comparing the transmission(More)
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