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The feature size reduction on IC chips following Moore's law leads to great integration challenge. Among others, the mechanical integrity of pad structures is particularly critical. However, to find suitable containment actions remain tricky, and a better knowledge and characterization of interfaces are then mandatory to face these problems. The(More)
The development of Cu/low-k interconnects to meet continuous tighter specifications (lower RC time delay, power consumption…) and consequently the introduction of mechanically weak materials is widely identified as a contributor of interfacial cracks propagating during manufacturing flow or qualification tests. Moreover, a raise in Front-End/Back-End(More)
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