D. J. Pavinski

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In this paper, the current state of the art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed(More)
In this work, a 10-wavelength, polarization-multiplexed, monolithically integrated InP coherent QPSK transmitter PIC is demonstrated to operate at 112 Gb/sec per wavelength and total chip superchannel bandwidth of 1.12 Tb/s. This demonstration suggests that increasing data capacity to multi-Tb/s per chip is possible and likely in the future.
We demonstrate a fully integrated multi-channel InP-based coherent transmitter photonic integrated circuits (PICs) with extended C-band tunability, operating at 33 and 44 Gbaud per channel under 16-QAM dual-polarization modulation. PICs are demonstrated integrating up to 14-channels enabling multi-Tb/s total PIC capacities.
In this talk, we report on a pair of monolithically integrated multi-wavelength transmitter and receiver PICs employing polarization multiplexing and quadrature phase-shift keying modulation to provide an aggregate bandwidth greater than 1Tbps on a single chip.
A dual-polarization QPSK transmitter is demonstrated with a record 40 tunable distributed feedback lasers, 80 nested Mach-Zehnder-modulators, and other elements totaling over 1700 functions monolithically integrated on a single InP-based chip that is capable of delivering 2.25 Tb/s.
Key advances which enabled the InP photonic integrated circuit (PIC) and the subsequent progression of InP PICs to fully integrated multichannel DWDM system-on-chip (SOC) PICs are described. Furthermore, the current state-of-the-art commercial multichannel SOC PICs are reviewed as well as key trends and technologies for the future of InP-based PICs in(More)