Corinne Bergès

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For the new ISO26262 standard deployment into the Automotive industry, failure rate estimation becomes a key issue to design new electronic products. The `IEEE1413.1 Guide for Selecting and Using Reliability Predictions' has identified difficulties to work from field returns. We present an innovative methodology addressing these issues for integrated(More)
For risk assessments in automotive semiconductor industry, while a typical field modeling uses failure mileages, a new time-based approach was implemented for a delamination issue on analog and sensor products. It highlighted a bimodality coherent with the failure analysis conclusions and with the two phases in the product life. Modeling per impacted wafer(More)
In semiconductor manufacturing for automotive, reliability constraints are strong: zero defect is expected by specific statistical techniques. In particular, distributions of the parametric electrical tests implemented at the probe or assembly steps, are controlled, test by test. In order to increase reliability in field by enhancement of potential failure(More)
In the automotive industry, risk analysis are performed as soon as quality incidents with the same defect signature are reported from the field. The tools used may be the defect distribution modeling, used for the failure rate estimations required by ISO26262 standard, but adapted to the stronger constraints of quality issues. One of these constraints is(More)
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