Claude Sarno

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Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the specifications at a minimum cost, Thales performs both mechanical and thermal simulations. The simulation level depends on the phases of design (preliminary or detailed). The major(More)
With the increase of heat flux densities generated by electronics, manufacturers are facing tremendous new challenges in which component heat flux might reach 100 W/cm2. This scenario is pushing the research efforts towards the development of alternative solutions, which will be able to ensure the needed cooling demands of highintegrated electronics.(More)
An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrate are considered: alumina and FR4 epoxy substrates, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal(More)
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