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In this study, electromigration (EM) performance of 60μm pitch Cu pillar bumps assembled with bump on trace (BOT) process by using thermal compression bonding with non-conductive paste (TCNCP) is investigated. Emphasis is placed on the EM experimental measurement and analysis of the Cu pillar bump on trace. The test temperature ranges from(More)
The electromigration (EM) behavior and performance of solder capped Cu pillar assembled with bump on trace (BOT) processed by mass reflow is measured and analyzed. The interconnections with two different Cu pillar bump structures were tested: Cu post + SnAg solder tip and Cu post + Ni barrier +SnAg solder tip. Emphasis is placed on the EM impact and(More)
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