Chunghyun Ryu

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We have thoroughly investigated the advantages of a silicon through-via (STV) interconnection in decreasing the inductive impedance of a power distribution network (PDN) and suppressing simultaneous(More)
A hierarchical power distribution network (PDN) consists of chip, package, and printed circuit board (PCB) level PDNs, as well as various structures such as via, ball, and wire bond interconnections,(More)