Chung-Kuang Lin

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Electromigration tests of SnAg solder bump samples with 15 µm bump height and Cu under-bump-metallization (UBM) were performed. The test conditions were 1.45ˆ10 4 A/cm 2 at 185 ˝ C and 1.20ˆ10 4 A/cm 2 at 0 ˝ C. A porous Cu 3 Sn intermetallic compound (IMC) structure was observed to form within the bumps after several hundred hours of current stressing. In(More)
By assuming that group buying websites offer consumers an opportunity to gain consumption value from experiential products with potential risks, a theoretical model was proposed to explore the factors affecting buyers' purchase intentions. In this model, trust, price consciousness and conformity behavior were viewed as antecedents of risks. A study of 164(More)
Tourists may rely on external information to make various decisions. By understanding the relation between information source characteristics and decision making, tourist operators can improve their communication performance and marketing efforts. Some businesses use corporate blog as a communication platform to engage their customers with the companies.(More)
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