BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this… (More)
We experimentally demonstrate the accuracy of an all-optical S-R latch and an optical S-R flip-flop based on hybrid integrated Mach-Zehnder Interferometers, with Semiconductor Optical Amplifier in each arm (MZI-SOA). The performance of both bistable devices will be studied and compared in terms of extinction ratio and switching times.