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The pattern of sulfur transformation in peat across the Everglades basin indicates that pyrite formation in organic-rich swamps depends on the use of organic oxysulfur compounds in dissimilatory respiration by sulfur-reducing bacteria. This paragenesis explains the primary distribution of sulfur compounds in low-sulfur coals and possibly in most coals and(More)
In this paper, an accelerated and cost-effective characterization method for bi-material interfaces under cyclic loading using a Miniaturized Cyclic Mixed-mode Bending (MCMB) test setup is presented. The Modified Single Leg Bending (MSLB) samples are acquired directly from production-line Thin Quad Flat Package (TQFP) which provide a mixed-mode I + II(More)
Thermoset-based adhesives are used as thermal and electrical interfaces. These adhesives are filled with different particles in order to meet heat transfer and electrical properties. In automotive applications, they are required to have excellent adhesion since delamination may precipitate other electrical, thermal or mechanical failure mechanisms. A vast(More)
When a bonding wire becomes too hot, it fuses and fails. The ohmic heat that is generated in the wire can be partially dissipated to a mold package. For this cooling effect the thermal contact between wire and package is an important parameter. Because this parameter can degrade over lifetime, the fusing of a bonding wire can also occur as a long-term(More)
Highly filled epoxy-based adhesives are used as thermal and electrical interfaces in automotive electronics. The successful design for reliability of electronic packages depends on understanding and modeling the fatigue behavior of these materials. Both mechanical and thermal loadings are varying in a cyclic manner in test or field conditions. To establish(More)
An in-situ and cost-effective numerical-experimental approach for fatigue characterization of bi-material interfaces in Microelectronic Packages is presented. In this method using a sample-centered approach a Miniaturized Sub-Critical Bending (MSCB) test setup is designed and fabricated based on the samples that are acquired directly from production-line.(More)
Thermoset-based adhesives are used as thermal and electrical interfaces. In automotive applications, they are required to have excellent adhesion since delamination may precipitate other electrical, thermal or mechanical failure mechanisms. A vast amount of literature is available on the investigation of molding compounds and various material interfaces.(More)
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