Chong Mong Ting

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This paper presents the challenges of time zero bond integrity for Palladium-coated Copper (Pd-Cu) wire bonding on C65 Aluminium (Al) bond pad low dielectric constant (low-k) wafer with Bond Over Active (BOA) pad structure. The LQFP-176 7.9mm×8.5mm, Rough micro Pre-Plated Frame (RµPPF) lead-frame design with the bonding temperature of(More)
This paper presents the development of evaluating the Palladium-coated Copper (Pd-Cu) and Bare Cu wire bonding material, along with two different type of ‘Low-k’ and conventional capillaries on two different Aluminium (Al) thickness underneath a C65 Nickel-Phosphorus/ Palladium/ Gold (Ni-P/Pd/Au) bond pad low-k dielectric material wafer with(More)
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