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Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
The effective thermal conductivity, elastic modulus, and coefficient of thermal expansion of epoxy resins filled with ceramic fillers like silica, alumina, and aluminum nitride were determined. TheExpand
Materials for Advanced Packaging
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides aExpand
Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites
Silver nanoparticles were surface functionalized with diacids and then incorporated into the polymer matrix with silver flakes as conductive fillers. By using appropriate diacids, the resistivity ofExpand
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Abstract Tin–lead solder alloys are widely used in the electronic industry. They serve as interconnects that provide the conductive path required to achieve connection from one circuit element toExpand
Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation.
Finite element analysis reveals promising applications for the magnetically aligned hBN-based composites in modern microelectronic packaging, including significantly reduced coefficient of thermal expansion and enhanced thermal conductivity. Expand
Graphene-based nitrogen self-doped hierarchical porous carbon aerogels derived from chitosan for high performance supercapacitors
Abstract Graphene-based nitrogen self-doped hierarchical porous carbon aerogels were synthesized for supercapacitor electrode application by using chitosan as a raw material through a carefullyExpand
Novel polymer–ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application
Embedded capacitor technology can increase silicon packing efficiency, improve electrical performance, and reduce assembly cost compared with traditional discrete capacitor technology. Developing aExpand
Glass transition and relaxation behavior of epoxy nanocomposites
With advances in nanoscience and nanotechnology, there is increasing interest in polymer nanocomposites, both in scientific research and for engineering applications. Because of the small size ofExpand
Solid-state spun fibers and yarns from 1-mm long carbon nanotube forests synthesized by water-assisted chemical vapor deposition
We report continuous carbon nanotube (CNT) fibers and yarns dry-drawn directly from water-assisted chemical vapor deposition (CVD) grown forests with about 1-mm height. As-drawn CNT fibers exist asExpand