Ching-Liang Weng

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This study was to investigate the use of a special high dielectric constant (Hi-DK) material for embedded passives in a Bluetooth system module. The stack structure of the module substrate was comprised of three kinds of material; Hi-DK, low loss-tangent and general organic material. Both experimental circuit and embedded passives can be implemented in this(More)
For getting more economy and smaller electronic products, technology of system in package (SiP) could complement the technology of system on a chip (SoC) perfectly. About SiP technology, we chose integral substrate technology to realize embedded passives, and used fine process such as high density interconnection (HDI) technology with a special dielectric(More)
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