Chikaaki Kodama

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In recent high-performance analog integrated circuit design, it is often required to place some cells symmetrically to a horizontal or vertical axis. Balasa et al. proposed a method of obtaining the closest placement that satisfies the given symmetry constraints and the topology constraints imposed by a sequence-pair (seq-pair). However, this method has the(More)
In this paper, we propose "selected sequence-pair" (SSP), a sequence-pair (seq-pair) with the limited number of subsequences called adjacent crosses. Its features are: (1) The smallest packing based on a given SSP can be obtained in <i>O(n)</i> time, where <i>n</i> is the number of rectangles. (2) An arbitrary packing can be represented by SSP. (3) The(More)
Recently, it is often required in high performance analog IC design that some cells are placed symmetrically to horizontal or vertical axis. Balasa et al. proposed a method of obtaining the closest placement satisfying the given symmetry constraints and the topology constraints imposed by a sequence-pair, but this method has the following defects: (1) Some(More)
In our dynamically reconfigurable system model, computation resources are arranged in 2D-plane and each partial task is assigned to computation resources of rectangle-shape for a certain time period. The problem can be regarded as a rectangular box packing problem in 3D-space of 2D-plane and time axis. However, since partial tasks have order constraints, a(More)
Sub-Resolution Assist Feature (SRAF) generation is a very important resolution enhancement technique to improve yield in modern semiconductor manufacturing process. Model- based SRAF generation has been widely used to achieve high accuracy but it is known to be time consuming and it is hard to obtain consistent SRAFs on the same layout pattern(More)
Although Self-Aligned Double and Quadruple Patterning (SADP, SAQP) have become the most promising processes for sub-20 nm and sub-14 nm node advanced technologies, not all wafer images are realized by them. In advanced technologies, feasible wafer images should be generated effectively by utilizing SADP and SAQP where a wafer image is uniquely determined by(More)
With the continuous shrinking of minimum feature sizes beyond current 193nm wavelength for optical micro lithography, the electronic industry relies on Resolution Enhancement Techniques (RETs) to improve pattern transfer fidelity. However, the lithographic process is susceptible to dose and focus variations that will eventually cause lithographic yield(More)
One of the most promising techniques in the 14 nm logic node and beyond is triple patterning lithography (TPL). Recently, LELECUT type TPL technology, where the third mask is used to cut the patterns, is discussed to alleviate native conflict and overlay problems in LELELE type TPL. In this paper, we formulate LELECUT mask assignment problem which maximizes(More)
The sequence-pair was proposed to represent a rectangle packing and a placement, and is used to place modules automatically in VLSI layout design. Several decoding methods of sequence-pair were proposed. However, encoding methods are not found except the original one called "gridding". The gridding requires almost O(n/sup 3/) time for a packing of n(More)