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Journals and Conferences
In this paper, a distributed intrusion alert system which is based on Honeypot technology is proposed. It is used to monitor unexpected actions appearing in different organizations. The motivation of this project comes from the hardness of detecting malicious activities without further assistance. The main advantage of this system is that it can monitor… (More)
We present several efforts for arcing reduction during high aspect ratio etching. Strategies including pulsing etching adjustments, ex situ multi-cyclic etch approach, flush step incorporation, E-chuck voltage operation, cap material, etc. are explored. The details are discussed in the paper.
This paper presents the methods of eliminating the plasma-induced Si substrate damage in periphery regions, resulting from high aspect ratio etching process for 3D NAND fabrication. The impact of Si substrate damage is verified by the low and high bias power experiments. The result indicates more Si damage is present with high energy bombardment; therefore,… (More)