Chih-Hong Hwang

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Modeling of device variability is crucial for the accuracy of timing in circuits and systems, and the stability of high-frequency application. Unfortunately, due to the randomness of dopant position in device, the fluctuation of device gate capacitance is nonlinear and hard to be modeled in current compact models. Therefore, a large-scale statistically(More)
As the dimension of semiconductor device shrunk into nanometer scale (nanoscale), characteristic fluctuation is more pronounced, and become crucial for circuit design. In this paper, discrete-dopant-induced characteristic fluctuation of 16-nm-gate metal-oxide-semiconductor field effect transistors (MOSFET) circuit under high-frequency regime is(More)
—This work for the first time estimates the influences of the intrinsic parameter fluctuations consisting of metal gate workfunction fluctuation (WKF), process variation effect (PVE) and random dopant fluctuation (RDF) on 16-nm-gate planar metal-oxide-semiconductor field effect transistors (MOSFETs) and circuits. The WKF and RDF dominate the threshold(More)
High-kappa/metal-gate and vertical channel transistors are well-known solutions to continue the device scaling. This work extensively explores the physics and mechanism of the intrinsic parameter fluctuations in nanoscale fin-type field-effect transistors by using an experimentally validated three-dimensional quantum-corrected device simulation. The(More)
Comparison of two different implantation processing techniques for random dopant (RD)-induced threshold voltage fluctuation (sigmaV(th)) in 15-nm metal-oxide-semiconductor (MOS) devices is reported. Implantations of flash lamp annealing and laser spike annealing are simulated using a kinetic Monte Carlo (KMC) technique. The KMC generated distributions are(More)
As the dimension of semiconductor device shrunk into nanoscale, characteristic fluctuation is more pronounced, and become crucial for circuit design. Diverse approaches have been reported to investigate and suppress the random-dopant-induced fluctuations in devices. However, attention is seldom drawn to the existence of high-frequency characteristic(More)
Novel chalcogenide-based phase change memory (PCM) is a promising candidate for next-generation non-volatile solid-state memory technology for its high resistance contrast, better endurance and writing speeds than flash memory. PCM cell stores data by a thermally induced phase transition between conductive polycrystalline (set) and resistive amorphous(More)
In this study, a three-dimensional ''atomistic " coupled device-circuit simulation is performed to explore the impact of process-variation-effect (PVE) and random-dopant-fluctuation (RDF) on static noise margin (SNM) of 16-nm complementary metal–oxide–semiconductor (CMOS) static random access memory (SRAM) cells. Fluctuation suppression approaches, based on(More)