Chih F. Chen

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Solder joints with Cu columns appear to be one of the best structures to resist electromigration. Three-dimensional thermoelectrical analysis was employed to simulate the current density and temperature distributions for eutectic SnPb solder bumps with 0.5, 5, 25, 50, and 100 lm Cu under bump metalli-zation (UBM). It was found that the hot spots and current(More)
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