Chien-Lin Weng

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Here we demonstrate the copper/dielectric TDDB improvement of 8 metal layers in 28nm technology node with 90 nm pitch. After the process optimization, the Weibull slope of MOM TDDB increase from 0.85 to 1.28 that improves the estimated MOM TDDB about 200 times. Keywords-BEOL, process optimization; reliability; TDDB
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