Chia-Jen Chang

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Tridiagonal solvers are important building blocks for a wide range of scientific applications that are commonly performance-sensitive. Recently, many-core architectures, such as GPUs, have become ubiquitous targets for these applications. Therefore, a high-performance general-purpose GPU tridiagonal solver becomes critical. However, no existing GPU(More)
The 3D IC is an emerging technology. The primary emphasis on 3D-IC routing is the interface issues across dies. To handle the interface issue of connections, the inter-die routing, which uses micro bumps and two single-layer RDLs (Re-Distribution Layers) to achieve the connection between adjacent dies, is adopted. In this paper, we present an inter-die(More)
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