Cheuk Yan Chan

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The mechanism of thermal conductivity enhancement of silver epoxy based die attach materials (DA) by iodine treatment is studied. Iodine treatment is found to be able to uniform the polymer network and accelerate the curing of die attach at relatively lower temperature with shorter curing duration. In addition, several metal halide salts are proved to have(More)
Die attach material (DA) is important to heat dissipation and light output of solid state lighting (SSL) packages. Even though high thermal conductivity benefits to reduce the bulk thermal resistance of die attach, high viscosity will increase the contact thermal resistance in the packages. To face such a dilemma, it is of desirable to develop new technique(More)
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