Chee Lip Gan

Learn More
Copper (Cu) based interconnect technology is expected to meet some of the challenges of technology scaling in the pursuit of higher performance. However, Cu interconnects are still susceptible to electromigrationinduced failure over time. We describe a new hierarchical approach for predicting the reliability of Cu-based interconnects in circuit layouts, and(More)
Solid gold is usually most stable as a face-centred cubic (fcc) structure. To date, no one has synthesized a colloidal form of Au that is exclusively hexagonal close-packed (hcp) and stable under ambient conditions. Here we report the first in situ synthesis of dispersible hcp Au square sheets on graphene oxide sheets, which exhibit an edge length of(More)
Under similar test conditions, the electromigration reliability of Al and Cu metallization interconnect trees demonstrates significant differences because of the differences in interconnect architectural schemes. In Cu technology, the low critical stress for void nucleation at the Cu and inter-level diffusion barrier, such as Si3N4, interface, leads to(More)
Free-standing and in-plane lateral nanowires (NWs) grown by the vapor-liquid-solid (VLS) process have been widely reported. Herein, we demonstrate that the VLS method can be extended to the synthesis of horizontally aligned semiconductor NWs embedded in substrates. Endotaxial SiGe NWs were grown in silicon substrates by tuning the directional movement of(More)
The synthesis of ultrathin face-centered-cubic (fcc) Au@Pt rhombic nanoplates is reported through the epitaxial growth of Pt on hexagonal-close-packed (hcp) Au square sheets (AuSSs). The Pt-layer growth results in a hcp-to-fcc phase transformation of the AuSSs under ambient conditions. Interestingly, the obtained fcc Au@Pt rhombic nanoplates demonstrate a(More)
Ultrathin Au nanowires (AuNWs) and tadpole-shaped nanowires are synthesized on graphene oxide (GO) sheet templates. For the first time, 1.6 nm-diameter AuNWs are shown to contain hexagonal close-packed (hcp) crystal domains, and the tadpole-shaped nanowires exhibit alternating sets of hcp and face-centered cubic (fcc) structures, associated with variation(More)
Shape memory materials are a class of smart materials able to convert heat into mechanical strain (or strain into heat) by virtue of a martensitic phase transformation. Some brittle materials such as intermetallics and ceramics exhibit a martensitic transformation but fail by cracking at low strains and after only a few applied strain cycles. Here we show(More)
We report a nanowire growth that is highly unconventional: (1) nanowires can grow from substrate-bound seeds but cannot from colloidal seeds under otherwise the same conditions; (2) the nanowires grow from only one side of the seeds, with their diameter independent of the size of the seeds; and (3) vertically aligned ultrathin nanowires are obtained on(More)